? semiconductor components industries, llc, 2015 september, 2016 ? rev. 14 1 publication order number: nl17sz126/d nl17sz126 non-inverting 3-state buffer the nl17sz126 is a high performance single noninverting buffer operating from a 1.65 v to 5.5 v supply. features ? extremely high speed: t pd 2.6 ns (typical) at v cc = 5.0 v ? designed for 1.65 v to 5.5 v v cc operation ? over voltage tolerant inputs and outputs ? lvttl compatible ? interface capability with 5.0 v ttl logic with v cc = 3.0 v ? lvcmos compatible ? 24 ma balanced output sink and source capability ? near zero static supply current substantially reduces system power requirements ? 3?state oe input is active high ? replacement for nc7sz126 ? chip complexity = 36 fets ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant figure 1. pinout (top view) v cc oe in a out y gnd in a out y oe figure 2. logic symbol 1 2 3 4 5 v cc oe a y gnd 1 2 3 5 4 sot?353/sc?88a/ sot?553 sot?953 see detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. ordering information marking diagram www. onsemi.com sc?88a (sot?353) df suffix case 419a sot?553 xv5 suffix case 463b m2 m m2 m m (note: microdot may be in either location) *date code orientation and/or position may vary depending upon manufacturing location. sot?953 case 527ae m 1 r m2 or r = specific device code (r with 180 degree clockwise rotation) m = date code = pb?free package
nl17sz126 www. onsemi.com 2 pin assignment (sot?353/sc?88a/sot?553/udfn) pin 1 2 3 4 5 function oe in a gnd out y v cc input function table a l h x output y l h z oe h h l pin assignment (sot?953) pin 1 2 3 4 5 function in a gnd oe out y v cc x = don?t care maximum ratings symbol parameter value unit v cc dc supply voltage ?0.5 to 7.0 v v in dc input voltage ?0.5 to 7.0 v v out dc output voltage (sot?353/sc?88a/sot?553 packages) ?0.5 to v cc +0.5 v v out dc output voltage output at high or low state (sot?953 package) power?down mode (v cc = 0 v) ?0.5 to v cc +0.5 ?0.5 to +0.5 v i ik dc input diode current ?50 ma i ok dc output diode current v out < gnd, v out > v cc (sot?353/sc?88a/sot?553 packages) 50 ma i ok dc output diode current (sot?953 package) v out < gnd ?50 ma i out dc output sink current 50 ma i cc dc supply current per supply pin 100 ma t stg storage temperature range ?65 to +150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias +150 c ja thermal resistance (note 1) sc?70/sc?88a 350 c/w p d power dissipation in still air at 85 c sc?70/sc?88a 150 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v?0 @ 0.125 in v esd esd withstand voltage human body model (note 2) machine model (note 3) charged device model (note 4) 2000 200 n/a v i latchup latchup performance above v cc and below gnd at 125 c (note 5) 100 ma stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. measured with minimum pad spacing on an fr4 board, using 10 mm?by?1 inch, 2 ounce copper trace with no air flow. 2. tested to eia/jesd22?a114?a. 3. tested to eia/jesd22?a115?a. 4. tested to jesd22?c101?a. 5. tested to eia/jesd78.
nl17sz126 www. onsemi.com 3 recommended operating conditions symbol parameter min max unit v cc dc supply voltage 1.65 5.5 v v in dc input voltage 0 5.5 v v out dc output voltage (sot?353/sc?88a/sot?553 packages) 0 5.5 v v out dc output voltage (sot?953 package) 0 v cc v t a operating temperature range 40 +125 c t r , t f input rise and fall time v cc = 1.8 v 0.15 v v cc = 2.5 v 0.2 v v cc = 3.0 v 0.3 v v cc = 5.0 v 0.5 v 0 0 0 0 20 20 10 5.0 ns/v device junction temperature versus time to 0.1% bond failures junction temperature c time, hours time, years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 failure rate of plastic = ceramic until intermetallics occur figure 3. failure rate versus time junction temperature normalized failure rate time, years t j = 130 c t j = 120 c t j = 110 c t j = 100 c t j = 90 c t j = 80 c
nl17sz126 www. onsemi.com 4 dc electrical characteristics symbo l parameter condition v cc (v) t a = 25 c 40 c t a 125 c uni t min typ max min max v ih high?level input voltage 1.65 to 1.95 2.3 to 5.5 0.75 v cc 0.7 v cc 0.75 v cc 0.7 v cc v v il low?level input voltage 1.65 to 1.95 2.3 to 5.5 0.25 v cc 0.3 v cc 0.25 v cc 0.3 v cc v v oh high?level output voltage v in = v ih i oh = ?100 a 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 v i oh = ?4 ma i oh = ?8 ma i oh = ?16 ma i oh = ?24 ma i oh = ?32 ma 1.65 2.3 3.0 3.0 4.5 1.29 1.9 2.4 2.3 3.8 1.52 2.15 2.80 2.68 4.20 1.29 1.9 2.4 2.3 3.8 v v ol low?level output voltage v in = v il i ol = 100 a 1.65 1.8 2.3 3.0 4.5 0.0 0.0 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v i ol = 4 ma i ol = 8 ma i ol = 16 ma i ol = 24 ma i ol = 32 ma 1.65 2.3 3.0 3.0 4.5 0.08 0.10 0.15 0.22 0.22 0.24 0.30 0.40 0.55 0.55 0.24 0.30 0.40 0.55 0.55 v i in input leakage current v in = 5.5 v or gnd 0 to 5.5 0.1 1.0 a i oz 3?state output leakage v in = v ih or v il 0 v v out 5.5 v 1.65 to 5.5 0.5 5.0 a i off power off leakage current (sot?353/ sc?88a/sot?553 packages) v in = 5.5 v or v out = 5.5 v 0 1.0 10 a i cc quiescent supply current v in = 5.5 v or gnd 5.5 1.0 10 a ac electrical characteristics (t r = t f = 3.0 ns) symbo l parameter condition v cc (v) t a = 25 c 40 c t a 125 c uni t min typ max min max t plh t phl propagation delay an to yn (figures 4, and 5, table 1) r l = 1 m c l = 15 pf 1.8 0.15 2.0 9.5 12 2.0 12.5 ns r l = 1 m c l = 15 pf 2.5 0.2 1.0 3.4 7.5 1.0 8.0 r l = 1 m c l = 15 pf r l = 500 c l = 50 pf 3.3 0.3 0.8 1.2 5.2 5.7 0.8 1.2 5.5 6.0 r l = 1 m c l = 15 pf r l = 500 c l = 50 pf 5.0 0.5 0.5 0.8 4.5 5.0 0.5 0.8 4.8 5.3 t pzh t pzl output enable time (figures 6, 7 and 8, table 1) r l = 250 c l = 50 pf 1.8 0.15 2.0 9.0 10.5 2.0 12.5 ns 2.5 0.2 1.8 8.5 1.8 9.0 3.3 0.3 1.2 6.2 1.2 6.5 5.0 0.5 0.8 5.5 0.8 5.8 t phz t plz output disable time (figures 6, 7 and 8, table 1) r l and r1= 500 c l = 50 pf 2.5 0.2 1.5 8.0 1.5 8.5 ns 2.5 0.2 1.5 8.0 1.5 8.5 3.3 0.3 0.8 5.7 0.8 6.0 5.0 0.5 0.3 4.7 0.3 5.0
nl17sz126 www. onsemi.com 5 capacitive characteristics symbol parameter condition typical unit c in input capacitance v cc = 5.5 v, v i = 0 v or v cc 2.5 pf c out output capacitance v cc = 5.5 v, v i = 0 v or v cc 2.5 pf c pd power dissipation capacitance (note 6) 10 mhz, v cc = 3.3 v, v i = 0 v or v cc 10 mhz, v cc = 5.5 v, v i = 0 v or v cc 9 11 pf 6. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no?load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc . c l * figure 4. switching waveform input r l *includes all probe and jig capacitance. a 1?mhz square input wave is recommended for propagation delay tests. figure 5. t plh or t phl output oe = v cc y 50% 50% v cc v cc gnd t plh t phl a figure 6. t pzl or t plz a 1?mhz square input wave is recommended for propagation delay tests. figure 7. t pzh or t phz a 1?mhz square input wave is recommended for propagation delay tests. c l = 50 pf r l = 500 output input r 1 = 500 2 v cc c l = 50 pf r l = 250 output v cc input 2.7 v 0 v 0 v oe on t pzh 3.0 v t phz t pzl t plz on v mo v mo v mi v cc v oh ? 0.3 v v ol + 0.3 v gnd v mi figure 8. ac output enable and disable waveform
nl17sz126 www. onsemi.com 6 table 1. output enable and disable times t r = t f = 2.5 ns, 10% to 90%; f = 1 mhz; t w = 500 ns symbol v cc 3.3 v 0.3 v 2.7 v 2.5 v 0.2 v v mi 1.5 v 1.5 v v cc/ 2 v mo 1.5 v 1.5 v v cc/ 2 device ordering information device package type shipping ? nl17sz126dft2g sc70?5/sc?88a/sot?353 (pb?free) 3000 / tape & reel NLV17SZ126DFT2G* sc70?5/sc?88a/sot?353 (pb?free) 3000 / tape & reel nl17sz126xv5t2g sot?553 (pb?free) 4000 / tape & reel nl17sz126p5t5g sot?953 (pb?free) 8000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable.
nl17sz126 www. onsemi.com 7 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419a?01 obsolete. new standard 419a?02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h --- 0.10 --- 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 b 0.2 (0.008) mm 12 3 4 5 a g s d 5 pl h c n j k ?b? sc?88a (sc?70?5/sot?353) case 419a?02 issue l mm inches scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 solder footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
nl17sz126 www. onsemi.com 8 package dimensions sot?553, 5 lead case 463b issue b e m 0.08 (0.003) x b 5 pl a c ?x? ?y? notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. d e y 12 3 4 5 l 1.35 0.0531 0.5 0.0197 mm inches scale 20:1 0.5 0.0197 1.0 0.0394 0.45 0.0177 0.3 0.0118 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h e dim a min nom max min millimeters 0.50 0.55 0.60 0.020 inches b 0.17 0.22 0.27 0.007 c d 1.50 1.60 1.70 0.059 e 1.10 1.20 1.30 0.043 e 0.50 bsc l 0.10 0.20 0.30 0.004 0.022 0.024 0.009 0.011 0.063 0.067 0.047 0.051 0.008 0.012 nom max 1.50 1.60 1.70 0.059 0.063 0.067 h e 0.08 0.13 0.18 0.003 0.005 0.007 0.020 bsc
nl17sz126 www. onsemi.com 9 package dimensions sot?953 case 527ae issue e *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* e d c a h e 123 4 5 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of the base material. 4. dimensions d and e do not include mold flash, protrusions, or gate burrs. dim min nom max millimeters a 0.34 0.37 0.40 b 0.10 0.15 0.20 c 0.07 0.12 0.17 d 0.95 1.00 1.05 e 0.75 0.80 0.85 e 0.35 bsc l 0.95 1.00 1.05 h e x y pin one indicator b 5x x 0.08 y l 5x l3 l2 e 5x 5x l2 0.05 0.10 0.15 l3 ??? ??? 0.15 0.175 ref top view side view bottom view 1.20 dimensions: millimeters 0.20 5x 1 package outline 0.35 pitch 0.35 5x p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 nl17sz126/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. ?
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